Empower Your Products with High-Performance Conductive Fiber Composites

Introduction

In a world where technology and materials are rapidly converging, the ability to innovate with cutting-edge materials can set your products apart. Our patented “Conductive Fiber Composites Containing Multi-Scale High Conductive Particles and Methods” (Patent #10828663) offers a breakthrough solution for industries looking to push the boundaries of what’s possible in conductivity and durability.

The Challenge

As electronic devices become more sophisticated and embedded in everything from clothing to cars, the demand for materials that combine flexibility, strength, and superior conductivity is skyrocketing. Traditional conductive materials often struggle with the trade-offs between performance and practicality—until now.

The Solution

Our patented conductive fiber composite leverages multi-scale high conductive particles, creating a material that is not only highly conductive but also strong and adaptable. Imagine integrating this composite into your products, enabling them to perform better, last longer, and open new avenues of design and functionality.

Why License This Technology?

Unmatched Conductivity: The multi-scale particles embedded in our fibers ensure that electricity flows efficiently, making this composite ideal for advanced electronics, smart textiles, and any application where reliable conductivity is crucial.
Versatility Across Applications: Whether you’re in automotive, aerospace, consumer electronics, or fashion tech, this composite material can be tailored to meet the specific needs of your industry, allowing for innovative product designs that set you apart from the competition.
Strength and Flexibility Combined: Unlike traditional conductive materials that may be brittle or limited in application, our composite offers the durability and flexibility you need to create products that are both high-performing and resilient.

The Opportunity

By licensing this patent, you’re not just adopting a material—you’re embracing a new standard in product innovation. Stay ahead of the curve and lead your industry with high-performance, conductive fiber composites that power the future.

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Abstract
Claims

Composite materials are provided that include a host material, nanoscale high conductive particles, and microscale high conductive particles. The nanoscale high conductive particles and the microscale high conductive particles may increase the through thickness thermal conductivity of the composite material by at least 4.0 W/(m·K), as compared to the same composite material without the nanoscale high conductive particles and microscale high conductive particles. Methods for making the composite materials herein also are provided.

We claim:

1. A method for making a composite material, the method comprising:

providing a host material,

contacting the host material with microscale metal particles and nanoscale metal particles to associate the host material with an amount of the microscale metal particles and the nanoscale metal particles sufficient to impart the composite material with at least a 0.4 volume % of metal particles, and

sintering the nanoscale metal particles.

2. The method of claim 1, further comprising forming a suspension prior to the contacting of the host material, wherein the suspension comprises a liquid and at least one of the microscale metal particles and the nanoscale metal particles.

3. The method of claim 2, wherein the suspension further comprises a resin.

4. The method of claim 3, wherein the resin comprises an epoxy resin.

5. The method of claim 1, wherein at least one of the microscale metal particles and the nanoscale metal particles comprise silver, copper, aluminum, or a combination thereof.

6. The method of claim 1, wherein the nanoscale metal particles are substantially spherical, and the microscale metal particles are flake shaped.

7. The method of claim 1, wherein the composite material has a through thickness thermal conductivity that is at least 4.0 W(m*K) greater than the through thickness thermal conductivity of the host material.

8. The method of claim 1, wherein the host material comprises a woven or non-woven fabric.

9. A method for making a composite material, the method comprising:

providing a host material comprising a woven or non-woven fabric, the woven or non-woven fabric comprising a plurality of fibers,

contacting the host material with a suspension comprising microscale metal particles, nanoscale metal particles, a liquid, and a resin to [1] deposit at least a portion of the nanoscale metal particles on a surface of the plurality of fibers, and [2] associate the host material with an amount of the microscale metal particles and the nanoscale metal particles sufficient to impart the composite material with at least a 0.4 volume % of metal particles, and

sintering the nanoscale metal particles;

wherein the composite material has a through thickness thermal conductivity that is at least 4.0 W(m*K) greater than the through thickness thermal conductivity of the host material.

10. The method of claim 9, wherein the suspension comprises a weight ratio of nanoscale metal particles to microscale metal particles of about 1:1 to about 1:3.

11. The method of claim 9, wherein the composite material has a through thickness thermal conductivity that is at least 10.0 W(m*K) greater than the through thickness thermal conductivity of the host material.

12. The method of claim 9, wherein the composite material comprises at least a 10.0 volume % of metal particles.

13. The method of claim 9, wherein the host material comprises a carbon fabric.

14. The method of claim 9, wherein the nanoscale metal particles are substantially spherical.

15. The method of claim 14, wherein the nanoscale metal particles comprise silver.

16. The method of claim 9, wherein the microscale metal particles are flake shaped.

17. The method of claim 16, wherein the microscale metal particles comprise silver.

18. The method of claim 17, wherein the microscale metal particles have an average diameter of less than 20 μm.

Title

Conductive fiber composites containing multi-scale high conductive particles and methods

Inventor(s)

Shaokai WANG, Zhiyong (Richard) Liang

Assignee(s)

Florida State University Research Foundation Inc

Patent #

10828663

Patent Date

November 10, 2020