As global data demands soar, the need for faster, more efficient interconnect technologies has become critical for data centers, semiconductor manufacturers, and telecommunications providers. Traditional electronic interconnects are approaching their physical limits, unable to meet the speed, bandwidth, and energy efficiency requirements of modern communication systems. Our Hybrid Photonic Plasmonic Interconnects (HyPPI) technology provides a breakthrough solution, combining the best of photonic and plasmonic systems to deliver unmatched performance in data transmission.
Conventional interconnect technologies, based purely on electronics or photonics, face significant limitations. Electronic interconnects, while effective, are slow and power-hungry when scaled to meet the demands of high-speed data transmission. On the other hand, photonic systems, while faster, often suffer from inefficiencies when trying to bridge the gap between optical and electronic domains. This has led to bottlenecks in data centers, cloud computing infrastructure, and high-speed telecommunications networks, which are increasingly strained by the global demand for more data at faster speeds.
Our HyPPI technology seamlessly integrates photonic and plasmonic systems, leveraging the speed of light and the compactness of plasmonic waves to create an interconnect that performs well beyond the capabilities of traditional methods. With both intrinsic and extrinsic modulation options, HyPPI offers unparalleled flexibility, enabling precise control over data transfer rates while minimizing energy consumption.
Licensing HyPPI offers your company a direct path to improving data transmission efficiency and performance in a rapidly evolving technological landscape. The hybrid approach, combining the best aspects of photonic and plasmonic systems, allows you to deliver products that not only meet today’s data demands but are ready for the future. It’s a strategic advantage for industries that rely on high-speed communication and data transfer.
As data demands continue to rise, the need for efficient, scalable interconnect technologies is critical. By licensing this hybrid photonic-plasmonic interconnect technology, you position your company at the forefront of the next wave of high-speed data communication, ensuring that your products deliver the speed, flexibility, and efficiency the market demands.
The invention claimed is:
Hybrid photonic plasmonic interconnects (HyPPI) with intrinsic and extrinsic modulation options
Shuai Sun, Volker J. Sorger, Tarek El-Ghazawi, Vikram K. NARAYANA, Abdel-Hameed A. BADAWY
George Washington University
10256600
April 9, 2019
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