Empower Devices with Flexible Energy Solutions

Introduction

As industries move toward greater efficiency, sustainability, and portability, the demand for advanced energy solutions has never been higher. Devices are becoming smaller, more flexible, and more integrated into daily life—whether they’re powering the latest wearable technology or providing renewable energy for remote devices. Our patented method for manufacturing flexible piezoelectric film-based power sources offers a transformative approach to energy generation, storage, and usage. Whether you’re developing next-gen wearables or seeking a sustainable, lightweight power solution, this innovation can take your products to the next level.

Challenges in Powering Flexible, Portable Devices

Powering small, portable, and flexible devices presents unique challenges. Traditional batteries are often bulky, rigid, and require frequent charging, limiting the potential of wearables and other flexible technologies. For industries focused on wearable technology, portable electronics, and renewable energy applications, the need for efficient, flexible power sources is growing rapidly. Without a flexible, scalable solution, these industries face barriers to innovation, hindering the development of next-gen products.

Why Choose Flexible Energy Solutions?

Our patented flexible piezoelectric film-based power source provides the ideal solution for industries seeking advanced energy capabilities. This innovative technology converts mechanical energy into electrical energy through flexible, lightweight films, offering a highly adaptable, sustainable power source. It is perfect for wearables, portable electronics, and remote energy applications where traditional batteries are not practical.

The piezoelectric nature of this technology allows it to harvest energy from motion, making it ideal for wearables and devices that need to generate power from movement. Whether integrated into clothing, sports equipment, or small electronics, this film-based power source delivers the energy needed while maintaining flexibility and durability. Additionally, the manufacturing process is scalable, enabling cost-effective production for large-scale adoption across multiple industries.

Key Benefits

  • Flexible Power Generation: Offers adaptable, piezoelectric energy for a wide range of devices.
  • Sustainable: Harvests energy from motion, reducing reliance on traditional batteries.
  • Lightweight and Durable: Perfect for wearables, portable electronics, and remote sensors.
  • Cost-Effective Manufacturing: Scalable technology designed for mass production.

Lead with Flexible Energy Solutions

Licensing this innovative piezoelectric film-based power source allows companies to embrace the future of portable energy. From wearables to renewable energy devices, this technology offers a sustainable, flexible solution that drives performance, efficiency, and adaptability across industries. Empower your products with a power source that keeps up with your innovative goals.

A method for manufacturing a piezoelectric element for generating electricity upon flexing of the element including the steps spin-coating a first substrate layer onto a support substrate; depositing a first electrode film onto the first substrate layer; spin coating polyvinylidene fluoride (PVDF) containing solution on the first electrode film to result in a PVDF film; annealing the PVDF film; depositing a second electrode film onto the PVDF film; spin-coating a second substrate layer on top of the second electrode film; forming a hole through the first and second substrate layers; filling the hole with silver paste to contact to the first and second electrode layers; peeling a resulting substrate/electrode/PVDF/electrode/substrate device from the support substrate; and placing a drop of silver paste in the hole formed in the first substrate layer.

The invention claimed is:

1. A method for manufacturing a piezoelectric element for generating electricity upon flexing of the element, comprising:

a. spin-coating a first substrate layer onto a support substrate;
b. depositing a first electrode film onto the first substrate layer;
c. spin coating polyvinylidene fluoride (PVDF) containing solution on the first electrode film to result in a PVDF film;
d. annealing the PVDF film;
e. depositing a second electrode film onto the PVDF film;
f. spin-coating a second substrate layer on top of the second electrode film;
g. forming a hole through the first and second substrate layers;
h. filling the hole with silver paste to contact to the first and second electrode layers;
i. peeling the support substrate from the first substrate layer resulting in a multilayer device;
j. placing a drop of silver paste in the hole formed in the first substrate layer.
2. The method of claim 1, further comprising repeating steps a-f at least once before proceeding to step g, to create a multi-PVDF layer device.
3. The method of claim 1, wherein the PVDF containing solution has a PVDF to solvent ratio of 20%.
4. The method of claim 1, wherein the spin-coating of the PVDF containing solution is carried out at a spin rate of about 4,000 rpm to about 12,000 rpm.
5. The method of claim 1, wherein the spin-coating of the PVDF containing solution is carried out at a spin rate of about 6,000 rpm to about 10,000 rpm.
6. The method of claim 1, wherein the spin-coating of the PVDF containing solution is carried out at a spin rate of about 9,000 rpm.
7. The method of claim 1, wherein annealing the PVDF film takes place at a temperature of about 0° C. to about 80° C.
8. The method of claim 1, wherein annealing the PVDF film takes place at a temperature of about 10° C. to about 50° C.
9. The method of claim 1, wherein annealing the PVDF film takes place at a temperature of about 20° C.
10. The method of claim 1, wherein the annealed PVDF film has a thickness of about 35 microns to about 60 microns.
11. The method of claim 1, wherein the annealed PVDF film has a thickness of about 15 microns to about 35 microns.
12. The method of claim 1, wherein the annealed PVDF film has a thickness of about 10 microns.
13. The method of claim 1, wherein the first and second substrate layers may comprise of polypropylene, polydimethylsiloxane, Teflon, nylon, acetate, rubber or elastomers.
14. The method of claim 1, wherein the first and second substrate layers may have a thickness of about 100 microns to about 5 nanometers.
15. The method of claim 1, wherein the first and second substrate layers may have a thickness of less than 1 nanometer.
16. The method of claim 1, wherein the first and second substrate layers may have a thickness of about 300 microns.
17. The method of claim 1, wherein the electrodes may be made of aluminum, copper, conductive plastic or conductive rubber.
18. The method of claim 17, wherein the electrodes may be made of aluminum or copper, and the thickness of the electrodes is from about 100 nanometers to about 300 nanometers.
19. The method of claim 18, wherein the electrodes have a thickness of about 150 nanometers to about 250 nanometers.
20. The method of claim 19, wherein the electrodes have a thickness of about 200 nanometers.
21. The method of claim 17, wherein the electrodes may be poly(3,4-ethylenedioxythiophene) polystyrene sulfonate having a thickness of about 1 micron to about 100 microns.
22. The method of claim 21, wherein the electrodes may have a thickness of about 40 microns to about 60 microns.
23. The method of claim 22, wherein the electrodes may have a thickness of about 50 microns.

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Title

Manufacturing of a flexible piezoelectric film-based power source

Inventor(s)

Birol OZTURK, Peker Milas

Assignee(s)

Morgan State University

Patent #

11990851

Patent Date

May 21, 2024

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